MULTILAYERED WIRING SUBSTRATE AND ELECTRONIC APPARATUS
作者： Kawai Kenichi
DOI:
关键词:
摘要: A multilayered wiring substrate (1) that includes at least one signal layer (3) and ground (2) is provided. The a first via (12A) extends in direction substantially perpendicular to the layers of substrate, conductively connected pair differential signaling wires (30A) provided layer, formed on grid point; second (12B) other (30A), point positioned diagonally adjacent with respect via.
lens.org 参考文章(15)
Shigeru Shinko Electric Ind. Co. Ltd. Mizuno, Michio Shinko Electric Ind. Co. Ltd. Horiuchi, Multilayer circuit board ,(2000)
Michael C. Freda, Ali Hassanzadeh, Han Y. Ko, Apparatus and system with increased signal trace routing options in printed wiring boards and integrated circuit packaging ,(1999)
Paul James Brown, Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid ,(2008)
Taras Kushta, Multi-layer substrate ,(2007)
Dale John Shidla, Robert William Dobbs, Andew Harvey Barr, Alternating voided areas of anti-pads ,(2003)
Ki-Hyun Ko, Kwang-Seop Kim, Do-hyung Kim, Jae-Jun Lee, Chil-Nam Yoon, Memory module and signal line arrangement method thereof ,(2006)
Farshad Ghahghahi, Routing density enhancement for semiconductor BGA packages and printed wiring boards ,(1999)
Atsushi Kikuchi, 木村 吉志, 池元 義彦, Yoshihiko Ikemoto, 菊池 敦, Yoshiji Kimura, Multilayer substrate and semiconductor device ,(2002)
Satoshi Muraoka, 諭 村岡, Lsi package, printed board and electronic apparatus ,(2009)