Method for automatically searching for and sorting failure signatures of wafers
作者： Kang-Mien Chiu
DOI:
关键词:
摘要: A method of searching for and sorting failure signatures wafers is provided. First, a signature database built up recording plurality data, wherein each data includes signature, location field the faulty dies, mode, position dependence information dependent signature. Next, selected wafer tested test result generated. Last, comparison generated by an automatic comparing device, hit or miss. When hit, further ratio. And as ratio exceeds predetermined value, step skipped.
lens.org 参考文章(9)
Stephen V. Pizzica, Signature analysis usage for fault isolation ,(1995)
David Yepejian Lepejian, Method for using wafer navigation to reduce testing times of integrated circuit wafers ,(1997)
Alan B. Helffrich, Yervant D. Lepejian, John M. Caywood, Automatic failure analysis system ,(1993)
Nick G. Eskandari, David D. Sprague, Method and apparatus for pseudo-direct access to embedded memories of a micro-controller integrated circuit via the IEEE test access port ,(1996)
Shiow-Hwan Sheu, Method for testing semiconductor wafers ,(2000)
Nobumi Hattori, 信美 服部, Toshimitsu Mugibayashi, 利光 麦林, Defect analyzing method, recording medium, and process control method ,(1998)
Yoshitake Yasuhiro, Iwata Hisafumi, Nemoto Kazunori, Morioka Natsuyo, Ono Makoto, Ikeda Yoko, Konishi Jiyunko, ELECTRONIC DEVICE INSPECTION SYSTEM AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE USING THE SAME ,(2000)