Flexible interconnect film including resistor and capacitor layers
作者： Richard Joseph Saia , Herbert Stanley Cole , Kevin Matthew Durocher
DOI:
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摘要: A method for fabricating a flexible interconnect film includes applying resistor layer over one or both surfaces of dielectric film; metallization the with including material facilitating adhesion and layer; capacitor electrode layer. The is patterned to form first electrode; patterned; resistor; are an inductor second electrode. In embodiment, polyimide, tantalum nitride, amorphous hydrogenated carbon oxide. If layers applied film, passive components can be fabricated on film. have vias therein extending through vias. circuit chip attached coupled by in additional
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