Apparatus for spreading heat over a finned surface

作者: Michael J. Wayman

DOI:

关键词:

摘要: An apparatus for spreading heat over a plurality of fins is provided. The includes dissipating member composed metal and having on first side the member. also strips thermal material conductivity in direction parallel to higher than member, disposed opposite configured spread along

参考文章(55)
Tunc Icoz, Haluk Sayir, Arik Mehmet, Evan Cooper, Marc Schaepkens, Xiang Liu, Advanced heat sinks and thermal spreaders ,(2006)
Thomas Fleischman, David L. Edwards, Paul A. Zucco, Anisotropic heat spreading apparatus and method for semiconductor devices ,(2005)
Prabjit Singh, Michael J. Ellsworth, Richard C. Chu, Egidio Marotta, Graphite-based heat sinks and method and apparatus for the manufacture thereof ,(2003)
Yoshihiko Asanuma, Yoshihumi Shimajiri, Device for releasing heat ,(1980)
Peter A. Davison, Heat sink attachment device ,(2003)
Haluk Sayir, John Thomas Mariner, High thermal conductivity composite and method ,(1997)
Gary D. Shives, Julian Norley, Robert Anderson Reynolds, Masaaki Tozawa, Kikuo Fujiwara, Sandwiched thermal solution ,(2004)