Electrical resistivity of solid and liquid Cu up to 5 GPa: Decrease along the melting boundary

摘要: Abstract The electrical resistivity of high purity Cu has been investigated by both experiments and first principle calculations at pressures up to 5 GPa temperatures in the liquid phase 1730 K. decreases with P increases T our data are very good agreement relation 1 atm data. Our melting temperature agree other experimental studies. We show that along P,T-dependent boundary disagreement prediction invariance boundary. These findings interpreted terms competing effects on electronic structure Cu. thermal conductivity is calculated from using Wiedemann-Franz law shown increase solid states but upon increase, it state.