作者: Robert K. Yasui , Robert L. Mueller
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摘要: Providing printed circuitry in a sandwiched relation with pair of flexible layers non-conductive material, depositing solder pads on the and storing resulting substrate drum, withdrawing from drum incrementally advancing it along linear path, serially transporting solderless solar cells into engagement thereafter heating for thus attaching to circuitry, cleaning excess flux cells, encapsulating protective coating spirally winding array drum.