Heat-radiation assembly and projector

摘要: The invention discloses a heat-radiation assembly and projector. is used for heat dissipation of source. comprises thermal conductingstructure, thermoelectric cooler, temperature sensor. conducting structure body projection part. provided with first surface second surface,which are respectively located at two opposite sides the body. part connected surface, configured to be thermally cooler surface. sensor orthographic on firstsurface covers least