作者: W.J. Zhu , J. Wang , L.B. Liu , H.S. Liu , Z.P. Jin
DOI: 10.1016/J.COMMATSCI.2013.05.025
关键词:
摘要: The growth kinetics of the TiC reaction layer during active brazing of diamond with Cu–Sn–Ti and Ag–Cu–Ti based filler alloy has been investigated by kinetic simulations and …