Investigation of interfacial reactions between Sn–Zn solder with electrolytic Ni and electroless Ni(P) metallization
作者： Ahmed Sharif , Yan Cheong Chan
DOI: 10.1016/J.JALLCOM.2006.09.020
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摘要: Abstract In this study, interfacial reactions of electrolytic Ni and electroless Ni(P) metallization the ball-grid-array (BGA) substrate with molten Sn–9Zn (wt.%) eutectic solder alloy were investigated, focusing on shear strengths identification intermetallic compound (IMC) phases at various reflow periods. Zn-containing Pb-free alloys kept in condition (240 °C) bond pads for different durations ranging from 1 to 60 min render ultimate reaction observe consecutive strength. After test, fracture surfaces investigated by scanning electron microscopy equipped an energy dispersive X-ray spectrometer. Cross-sectional studies interfaces also conducted correlate surfaces. The ball shear-load system during extended increased increase time. consumption layer was lower than that Ni. It evident Sn–Zn solder/electrolytic more vulnerable solder/electroless high temperature long time liquid state annealing. appeared as a good combination soldering technology.
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