Plasma-enhanced chemical-vapour-deposition of thin films by corona discharge at atmospheric pressure

摘要: Abstract A corona discharge (also called dielectric barrier or silent discharge) near at atmospheric pressure was used for the deposition of organic and inorganic thin films low temperatures. Inorganic SiOx were deposited with tetramethylsilane (TMS, Si[CH3]4) tetraethylortosilicate (TEOS, Si[OC2H5]4) in oxygen-containing atmospheres. In inert argon/nitrogen atmospheres, TMS formed amorphous plasmapolymerlike hydrogenated silicon carbon coatings (a-SiC:H). Hydrocarbons like methane (CH4), ethine (C2H2) propargyl alcohol (HC2CH2OH) as monomers lead to polymer-like (a-C:H). With tetrafluoroethene (C2F4) teflon-like (a-C:F) deposited. Surface energies between 16 66 mN m−1 on 62 mN m−1 polypropylene obtained depending film composition.