Effect of composition and thermal cycling on the adhesion strength of Sn-Zn-Al solder hot-dipped on Cu substrate

摘要: Reliability losses in many electronic systems were identified with the failure of solder joints rather than device malfunctions. The adhesion strength is an important factor for assessing reliability joints. In this work, a pull-off test was used to investigate at interface (100 − x)Sn-x(5Al-Zn) lead-free solders on Cu substrate as-soldered and after thermal cycling, respectively. For x value increased up 40 wt%, decreased from 11.8 ± 1.5 3.3 0.9 MPa. After cycling (−20–120°C) cycles, 95Sn-5(5Al-Zn) 91Sn-9(5Al-Zn) 11.2 1.7 8.2 1.3, 7.6 0.7 5.0 0.8 MPa, However, 80Sn-20(5Al-Zn), 70Sn-30(5Al-Zn) 60Sn-40(5Al-Zn) 5.7 13.3 1.9 4.8 2.0 12.2 1.8 16.2 1.2 formation intermetallic compound (IMC) proposed enhancement study.