Adhesives, adhesive layers for electroless plating and printed circuit boards
作者： Dong D. Wang , Motoo Asai
DOI:
关键词:
摘要: An adhesive usable for electroless plating in the formation of printed circuit boards is formed by dispersing a cured heat-resistant resin powder soluble an acid or oxidizing agent into uncured matrix hardly after curing treatment, which mixture thermoplastic and thermosetting photosensitive resin.
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