Low-cost and ultra-fine integrated circuit packaging technique
作者： Clinton Chao
DOI:
关键词:
摘要: A semiconductor package structure and the methods for forming same are provided. The includes an interposer; a first plurality of bonding pads on side chip; second chip. bonded through metal-to-metal bonds.
lens.org 参考文章(3)
Armin Klumpp, Peter Ramm, Method of vertically integrating electric components by means of back contacting ,(2000)
Francis R. White, Paul A. Farrar, Willem B. van der Hoeven, Howard L. Kalter, Claude L. Bertin, Gordon A. Kelley, Three-dimensional multichip packages and methods of fabrication ,(1991)
Hung Ngoc Nguyen, Electronic device interconnection techniques ,(1991)