Mechanism-Based Modeling of Thermal- and Moisture-Induced Failure of IC Devices

摘要: IC packages are multi-layered structures with a large number of interfaces joining oxides, metals, and polymers. For these structures, interface separation is often the result nucleation, growth, coalescence voids. The larger micro-pores cavities observed within adhesive film, as well along film–substrate interfaces, therefore poses serious threat to structural integrity packages. A common occurrence interfacial failure during surface mounting electronic onto printed circuit board under reflow temperatures 220–260°C. These exceed glass transition temperatures, T g, polymeric adhesives molding compounds can induce high thermal misfit stresses at die/adhesive die/molding compound interfaces. Prior soldering, moisture diffuses through hygroscopic materials condenses micro-pores.