Two-sided fan-out wafer escape package
作者： Ronald Patrick Huemoeller , David Hiner , Russ Lie
DOI:
关键词:
摘要: A method of forming an electronic component package includes: electrically conductive traces for connecting first selected bond pads a plurality on surface to corresponding bonding locations formed second the component; coupling lower dielectric strip; upper via apertures through strip expose filling and with material form vias coupled component.
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