Ion‐induced desorption by Ar+ ions from Al, Cu and films of Cu grown on stainless steel

摘要: The ion-induced desorption yield from pure aluminium, oxygen free high conductivity copper (OFHC) and films of electrodeposited on stainless steel, has been studied for unbaked samples after 24 h baking at 80, 120, 150 200 °C. Measurements were performed using argon ions energy 3 keV current density 2.5(×10 -8 )-10 -6 A cm -2 . is focused those gases usually present in ultrahigh vacuum systems, such as H 2 , CO, CO CH 4 C x y yields are presented a function the ion dose to sample surface discussed according material treatment. lowest 6.5 6.8 molecules per ion, respectively, obtained Al Cu bake-out system