Interaction between helium bubbles and migrating grain boundaries in copper
作者： S.R Pati , P.S Maiya
DOI: 10.1016/0001-6160(71)90137-4
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摘要: Abstract The interaction between migrating grain boundaries and helium bubbles in copper was studied the temperature range 840–990°C. Helium (0.22 μ radius) were formed single-crystal specimens by cyclotron irradiation with alpha particles subsequent isothermal annealing. Grain introduced into crystals indenting annealing observed to drag gas as migrated. kinetics of bubble dragging investigated a function time temperature. process are approximately an order magnitude slower than expected from surface-diffusion mechanism. These results discussed on basis bubble-migration model that considers nucleation surface steps required for migration faceted bubbles.
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