320 Gb/s high-speed ATM switching system hardware technologies based on copper-polyimide MCM
作者： N. Yamanaka , Ken-ichi Endo , K. Genda , H. Fukuda , T. Kishimoto
DOI: 10.1109/96.365493
关键词:
摘要: … polyimide substrate to reduce the LSI footprint using 150 pm very-thin outer lead TAB mounted using solder connection … These MCM’s are connecting by FPC cables that have high-…
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