Method for the manufacture of multilayer printed circuit boards

摘要: Process for manufacturing printed circuit boards in which a radiation curable material (10) is applied to substrate (14), the exposed and developed expose those regions where first conductor pattern be formed. The covered plated and/or sputtered with metal (24). A second layer of (18) processed like one, onto said electrolessly coating (24) (32) forms remainder (32). These steps are repeated form additional conductive patterns.