Wafer processing method
作者： Karl Heinz Priewasser
DOI:
关键词:
摘要: A wafer processing method including the steps of storing information on intervals and positions metal patterns formed part division lines a into storage unit cutting apparatus, detecting lines, forming cut groove along each line by using blade, imaging an area at any position where are not formed, included in according to previously stored, during step grooves, measuring positional relation between preset position. Accordingly, kerf check can be performed without being influenced burrs produced from wafer, so that with high accuracy.
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