Liquid adhesive for electronic parts and adhesive tape

摘要: An adhesive for electronic parts, which can be used bonding and cured at a relatively low temperature has sufficient heat resistance reliability, an tape the above is adapted, being liquid obtained by dissolving acrylonitrile-butadiene copolymer as Component (a), phenolic resin (b), compound having least 2 maleimide groups (c) diamine of general formula (1) specified in claim 1, and/or polysiloxane terminating with amino group each terminal, weight average molecular 200 to 7,000 (d) organic solvent, total amount Components per 100 parts (a) 10 900 weight, (b) based on 90% mole equivalent 0.01 2.0 equivalents.