作者: Hideaki Umakoshi , Akira Ishigami , Shiyuki Kanisawa , Masaharu Aoki , Hidetsugu Namiki
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摘要: A light-reflective anisotropic conductive paste is used as an when a light-emitting device produced by flip-chip mounting element such diode (LED) on wiring board. The includes insulating particles, in order to improve light emission efficiency without providing, the LED, light-reflecting layer that causes increase manufacturing cost. With paste, reduction bonding strength of board high-temperature environment can be suppressed, and conduction reliability after TCT also suppressed. In particles are dispersed thermosetting resin composition. composition contains epoxy compound thermal catalyst-type curing agent.