Transient liquid phase sintering conductive adhesives

摘要: An inventive method for electrical and thermal electronic component attachment is disclosed. The combination of transient liquid phase sintering (TLPS) a permanent adhesive flux binder provides the advantages both conventional soldering technology conductive adhesives. This hybrid approach delivers conduction through sintered metal joints mechanical properties based on tailorable polymer matrix. These adhesives can utilize dispensing, placement, processing equipment. During reflow process, powders in composition undergo interparticle as well alloying to contact pads. process produces strong mechanical, thermal, interconnect which ensures good conductivity that also resistant humidity temperature cycling.