Method of manufacturing a compact optical semiconductor module capable of being readily assembled with a high precision
作者： Yasuhisa Tanisawa
DOI:
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摘要: In an optical semiconductor module having chip mounted on a substrate through plurality of solder bumps each which has predetermined height and is formed by molten solder, the surrounded side wall lower than bump. The precisely positioned not only in horizontal direction self-alignment effect but also vertical due to shrinkage with bottom surface kept contact upper walls, upon cooling solder.
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