作者: T. Rangelov , P. Dineva , D. Gross
DOI: 10.1007/PL00003917
关键词:
摘要: A numerical procedure for the solution of a wave propagation problem in solder joint with line crack its base layer is presented. The two-dimensional ``in-plane'' finite, multilayered body one layers solved by combined usage displacement and traction BIEM. discretization boundary parabolic elements far from edge quarter-point crack-tip containing correct \(O(\sqrt{r})\) behavior variations at used. Numerical results real geometry physical properties are relations between scattering problems, fatigue state estimation, reliability quality electronic packages discussed.