A model for the width dependence of electromigration lifetimes in aluminum thin‐film stripes
作者： E. Kinsbron
DOI: 10.1063/1.91385
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摘要: Aluminum thin‐film conductors with a variety of linewidths (1–8 μ) were stressed at high temperature (200 °C) and current density (2×106 A cm−2) to determine the dependence on linewidth time failure due electromigration. A new model is based consideration film microstructure presence stress‐induced countercurrent flow matter in short thin films during passage electrical current. The can explain increase lifetime observed stripes below 2 μm.
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E. Kinsbron, I.A. Blech, Y. Komem, The threshold current density and incubation time to electromigration in gold films Thin Solid Films. ,vol. 46, pp. 139- 150 ,(1977) , 10.1016/0040-6090(77)90056-6
KL Chopra, RC Kainthla, DK Pandya, AP Thakoor, Physics of Thin Films Journal of The Electrochemical Society. ,vol. 111, pp. 85C- ,(1964) , 10.1149/1.2426128
I.A. Blech, E. Kinsbron, Electromigration in thin gold films on molybdenum surfaces Thin Solid Films. ,vol. 25, pp. 327- 334 ,(1975) , 10.1016/0040-6090(75)90052-8
S. Vaidya, T. T. Sheng, A. K. Sinha, Linewidth dependence of electromigration in evaporated Al‐0.5%Cu Applied Physics Letters. ,vol. 36, pp. 464- 466 ,(1980) , 10.1063/1.91508
A. P. Ingraham, B. N. Agarwala, M. J. Attardo, Dependence of Electromigration‐Induced Failure Time on Length and Width of Aluminum Thin‐Film Conductors Journal of Applied Physics. ,vol. 41, pp. 3954- 3960 ,(1970) , 10.1063/1.1658395
I. A. Blech, Electromigration in thin aluminum films on titanium nitride Journal of Applied Physics. ,vol. 47, pp. 1203- 1208 ,(1976) , 10.1063/1.322842
I. A. Blech, Conyers Herring, Stress generation by electromigration Applied Physics Letters. ,vol. 29, pp. 131- 133 ,(1976) , 10.1063/1.89024