Managing heat for electronics

摘要: Increasing power densities and decreasing transistor dimensions are hallmarks of modern computer chips. Both trends increasing the thermal management challenge within chip surrounding packaging, as well accelerating research progress on high-conductivity materials. This article reviews recent materials advances with a focus novel composite substrates interface materials, including those composites leveraging high conductivities carbon nanotubes. Furthermore, attention is given to special properties one-dimensional structures that likely be importance in future applications.