LED chip with improved bonding strength and LED module using the LED chip
作者： Won Yelim , Kim Daewon
DOI:
关键词:
摘要: An LED module is disclosed. The includes: a mount substrate including electrodes; an chip semiconductor stacked structure, passivation layer covering the outer surface of and electrode pads connected to structure through openings formed in layer; solder bumps connecting corresponding electrodes using material represented by Sn-M (where M metal).
lens.org 参考文章(14)
Eiji Hashino, Shinichi Terashima, Masamoto Tanaka, Shinji Ishikawa, Lead-free solder bump bonding structure ,(2013)
Hee Seok Choi, Pil Geun Kang, Young Ju Han, Deok Ki Hwang, Seok Beom Choi, Ju Won Lee, Light emitting device and light emitting apparatus ,(2011)
Akihiro Kojima, Yoshiaki Sugizaki, Semiconductor light-emitting device and method for manufacturing same ,(2010)
Toshitaka Shimamoto, Kouji Makita, Kenji Yoshikawa, Ohmic electrode structure and semiconductor element ,(2008)
Akihiro Kojima, Yoshiaki Sugizaki, Hideto Furuyama, Composite resin and electronic device ,(2014)
Sang Won Woo, Ye Seul Kim, Ji Hye Kim, Kyoung Wan Kim, Compact light emitting diode chip, light emitting device and electronic device including the same ,(2016)
Lee Sang Youl, Seo Jae Won, Lim Woo Sik, Light-emitting element and light-emitting element package including the same ,(2017)
Sun Jia-Hong, Hsu Hai-Wen, ELECTRODE STRUCTURE OF LIGHT EMITTING DIODE ,(2018)
Jeong Byung Hak, Park Sang Rock, Jung Young Kuen, Moon Sung Wook, Hong Ki Yong, Ko Eun Bin, Park Duk Hyun, Light emitting device and display comprising same ,(2017)
Fukada Takashi, Horie Hideyoshi, SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND SEMICONDUCTOR LIGHT-EMITTING DEVICE ,(2009)