Analysis and design of MEMS and embedded components in silicon/LTCC packages using FDTD/MRTD for system-on-package applications (SOP)
作者： M. Tentzeris , N. Bushyager , J. Laskar , G. Zheng , J. Papapolymerou
DOI: 10.1109/SMIC.2003.1196689
关键词:
摘要: The FDTD and MRTD full-wave numerical techniques are applied to the modeling analysis of embedded components, such as MEMS, in silicon packages. Preliminary design rules derived for minimized-crosstalk transmission lines, a wideband compact transition, MEMS switch that can be used practical tuning applications packaging adaptive antenna.
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