Elastically deformable integrated-circuit device

摘要: The present invention relates to an integrated-circuit device comprising a multitude of separate rigid substrate islands (202 208) with circuit elements, respective island being connected neighbor by elastically deformable connections (210 222), which contain at least one signaling layer that is made electrically conductive material. At connection between has layer, not and thus forms dummy (210a 210c), the connections, connect along first direction, have elastic deformability in direction governed moduli elasticity, ratio 0.5 2.0. This reduces inhomogeneity strain network formed device. functional reliability increased over prior-art devices without restricting freedom design.