Filling voids with filled hotmelt adhesive
作者： Hans T. Oien
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摘要: A reactive hot melt adhesive and/or sealing composition having a heat of crystallization in joules/gram -2 or lower, comprising curable heat-flowable material and particulate filler, wherein said has thermal conductivity less than 0.30 W/m·°C. The invention also relates to method using the adhesive/sealer described herein fill cavity recess substrate filled substrates formed thereby.
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