Plastic pin grid array package
作者： Charles Cohn
DOI:
关键词:
摘要: This invention is a simple and effective process of producing plastic pin grid array package having an encapsulated device heat sink forming unitary component main planar body the package. The includes fabrication laminated outer sheets provided with metallizations, metal sheet high thermal conductivity, positioned intermediate sheet, clearance holes filled plugs material sheets, plurality plated-through (PTHs) formed in terminal pins secured PTHs. Some PTHs contacting some passing through out contact sheet. device, such as integrated circuit chip, mounted recessed cavity body, heat-sink. In this manner conducted away from by dissipated back those which are sink.
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