Semiconductor device and its manufacturing process

摘要: PROBLEM TO BE SOLVED: To provide a semiconductor device having compound function which can be provided as thin and compact product where chip is mounted on wiring board while being embedded. SOLUTION: A substrate pattern 17 connected electrically between layers through copper bumps formed by hot pressing foil with prepreg 20. The the outer surface of etching exposed to according specified pattern. One side then counterbored form cavity 22 for mounting chip, end face bump 16b inner 30 are electrically. in filled resin 24 thus sealing 30. COPYRIGHT: (C)2005,JPO&NCIPI