作者: Philip T. Klemarczyk , Yoshihisa Okamoto , James P. Moran
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摘要: Resin compositions useful for filament winding applications comprising an epoxy component including at least one polyepoxide resin curable by heat, olefinicially unsaturated monomer polyolefinically actinic radiation, a cyanate ester compound having two functional groups per molecule, organic peroxide, photoinitiator, and heat activated curing agent epoxides. The have viscosity less than about 2000 centipoise (cps) are capable of retaining this 6 months ambient temperature. resins being immobilized radiation exposure further cured without substantial drip. One or more peroxides employed, selected from the group 10 hour decomposition half-lives temperatures 50° C. to 104° Also, fiber composites substrates impregnated with dual-curing compositions. Also process coating is disclosed.