作者: Ahmadreza Rofougaran
DOI:
关键词:
摘要: Methods and systems for an integrated circuit package with ferrimagnetic and/or ferromagnetic layers are disclosed may include processing a received signal via single chip comprising one or more of material. The be amplified the material Circuits within impedance matched comprise microwave signal. deposited on chip. ink printing, spin-on, electron beam deposition, evaporation technique.