Process for the manufacture of circuit boards

摘要: A process for extending and fixing conductors to circuit board base surfaces between pre-established spaced points in straight paths inflected paths, the steps comprising, end of conductor a pad at first pair pre-selected and, while feeding with guide, moving guide relative each other along path second or an inflection point, if is be inflected, then said pad. Severing affixing Repeating foregoing until has been affixed pairs pads points. After all have interconnected either blank surface adhesive by applying pressure pattern.