The kinetics of isostatic diffusion bonding in superplastic materials
作者： John Pilling
DOI: 10.1016/0025-5416(88)90249-2
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摘要: Abstract A model has been developed to predict the time required attain full interfacial contact during diffusion bonding under an isostatic state of stress. It shown that occurs primarily as a result time-dependent (super)plastic flow material into voids created when two surfaces be bonded are brought contact. For within superplastic regime, temperature and pressure have little effect on kinetics bonding. However, variations in absolute scale surface roughness, through tension, substantial time. Discrepancies between measured predicted times for Ti6Al4V suggest reduction long-range waviness plays significant part process does closure short wavelength roughness.
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