Germanium on insulator fabrication technology

作者: John Hennessy

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参考文章(18)
J.L. Hoyt, H.M. Nayfeh, S. Eguchi, I. Aberg, G. Xia, T. Drake, E.A. Fitzgerald, D.A. Antoniadis, Strained silicon MOSFET technology international electron devices meeting. pp. 23- 26 ,(2002) , 10.1109/IEDM.2002.1175770
W. P. Maszara, G. Goetz, A. Caviglia, J. B. McKitterick, Bonding of silicon wafers for silicon‐on‐insulator Journal of Applied Physics. ,vol. 64, pp. 4943- 4950 ,(1988) , 10.1063/1.342443
D. P. Vu, M. Haond, D. Bensahel, M. Dupuy, Halogen lamp recrystallization of silicon on insulating substrates Journal of Applied Physics. ,vol. 54, pp. 437- 439 ,(1983) , 10.1063/1.331677
Yaocheng Liu, Michael D. Deal, James D. Plummer, High-quality single-crystal Ge on insulator by liquid-phase epitaxy on Si substrates Applied Physics Letters. ,vol. 84, pp. 2563- 2565 ,(2004) , 10.1063/1.1691175
K. Kusukawa, M. Moniwa, M. Ohkura, E. Takeda, Enhancement of lateral solid phase epitaxy over SiO2 using a densified and thinned amorphous Si layer Applied Physics Letters. ,vol. 56, pp. 560- 562 ,(1990) , 10.1063/1.103301
S Gan, L Li, T Nguyen, H Qi, R.F Hicks, M Yang, Scanning tunneling microscopy of chemically cleaned germanium (100) surfaces Surface Science. ,vol. 395, pp. 69- 74 ,(1998) , 10.1016/S0039-6028(97)00608-0