Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics
作者： Hyejun Kang , Ashutosh Sharma , Jae Pil Jung
DOI: 10.3390/MET10070934
关键词:
摘要: … Transient liquid phase (TLP) bonding is a novel bonding process for the joining of metallic and ceramic materials using an interlayer. TLP bonding is particularly crucial for the joining of …
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D.F. Paulonis, D.S. Duvall, W.A. Owczarski, TLP bonding: a new method for joining heat resistant alloys Welding Journal. ,vol. 53, pp. 203- 214 ,(1974)
Hyung-Seop Shin, Michael de Leon, Parametric study in similar ultrasonic spot welding of A5052-H32 alloy sheets Journal of Materials Processing Technology. ,vol. 224, pp. 222- 232 ,(2015) , 10.1016/J.JMATPROTEC.2015.05.013
Hongjun Ji, Yunfei Qiao, Mingyu Li, Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application Scripta Materialia. ,vol. 110, pp. 19- 23 ,(2016) , 10.1016/J.SCRIPTAMAT.2015.07.036
Kunmo Chu, Yoonchul Sohn, Changyoul Moon, A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding Scripta Materialia. ,vol. 109, pp. 113- 117 ,(2015) , 10.1016/J.SCRIPTAMAT.2015.07.032
Xiangdong Liu, Siliang He, Hiroshi Nishikawa, Thermally stable Cu3Sn/Cu composite joint for high-temperature power device Scripta Materialia. ,vol. 110, pp. 101- 104 ,(2016) , 10.1016/J.SCRIPTAMAT.2015.08.011
K. K. Chen, Y. S. Zhang, Numerical analysis of temperature distribution during ultrasonic welding process for dissimilar automotive alloys Science and Technology of Welding and Joining. ,vol. 20, pp. 522- 531 ,(2015) , 10.1179/1362171815Y.0000000022
A. Sharma, D.-U. Lim, J.-P. Jung, Microstructure and brazeability of SiC nanoparticles reinforced Al–9Si–20Cu produced by induction melting Materials Science and Technology. ,vol. 32, pp. 773- 779 ,(2016) , 10.1179/1743284715Y.0000000138
Jae Pil Jung, Choon Sik Kang, Transient Liquid Phase Process in Ni–B Joining Materials Transactions Jim. ,vol. 38, pp. 886- 891 ,(1997) , 10.2320/MATERTRANS1989.38.886
Adrian Lis, Christian Leinenbach, Effect of Process and Service Conditions on TLP-Bonded Components with (Ag,Ni–)Sn Interlayer Combinations Journal of Electronic Materials. ,vol. 44, pp. 4576- 4588 ,(2015) , 10.1007/S11664-015-3982-3
Torleif A. Tollefsen, Andreas Larsson, Ole Martin Løvvik, Knut Aasmundtveit, Au-Sn SLID Bonding—Properties and Possibilities Metallurgical and Materials Transactions B-process Metallurgy and Materials Processing Science. ,vol. 43, pp. 397- 405 ,(2012) , 10.1007/S11663-011-9609-Z