作者: Ping Zhou
DOI:
关键词:
摘要: A hermetically sealed photonic device submount includes a mounted on substrate material and in flexible hermetic seal. In one configuration, the is configured to emit or receive light through material. this covered with an adhesive layer metal depositd onto layer. another direction substantially vertically upward from cover placed over device, then both configurations, submounts are according various aspects of present invention without using separate package. Accordingly, any number can be mass produced wafers invention.