Semiconductor chip package and method for fabricating semiconductor chip
作者： Young-Yong Byun , Hi-choon Lee , Chul-Hwan Choo
DOI:
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摘要: A semiconductor chip package and a fabricating method are provided. comprises at least two chips having stacked configuration, the one of: sharing DC signals of generating circuits provided by chips; DLL clock signal circuit or another chip. Power consumption can be reduced, is valid. In addition, stabilized supply guaranteed an increase for level trimming range productivity improved.
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