Nickel-stabilized hexagonal (Cu,Ni)6Sn5 in Sn-Cu-Ni lead-free solder alloys
作者： Kazuhiro Nogita , Tetsuro Nishimura
DOI: 10.1016/J.SCRIPTAMAT.2008.03.002
关键词:
摘要: … the use of expensive silver or rare earth elements that are present in competing alloys [2]. … in this ternary alloy differ from those in Sn–Cu binary alloys. The phase diagram of the Sn–Cu …
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A.-K. Larsson, L. Stenberg, S. Lidin, The superstructure of domain‐twinned η'‐Cu6Sn5 Acta Crystallographica Section B-structural Science. ,vol. 50, pp. 636- 643 ,(1994) , 10.1107/S0108768194004052
S. Hanada, Z. Zhong, S.W. Nam, R.N. Wright, The Fourth Pacific Rim International Conference on Advanced Materials and Processing (PRICM4) The Japan Institute of Metals. ,(2001)
N. T. S. Lee, V. B. C. Tan, K. M. Lim, First-principles calculations of structural and mechanical properties of Cu6Sn5 Applied Physics Letters. ,vol. 88, pp. 031913- ,(2006) , 10.1063/1.2165280
YI Li, Kyoung-sik Moon, CP Wong, Electronics Without Lead Science. ,vol. 308, pp. 1419- 1420 ,(2005) , 10.1126/SCIENCE.1110168
J. D. BERNAL, The Complex Structure of the Copper–Tin Intermetallic Compounds Nature. ,vol. 122, pp. 54- 54 ,(1928) , 10.1038/122054A0
Tina Ventura, Christopher M. Gourlay, Kazuhiro Nogita, Tetsuro Nishimura, Michel Rappaz, Arne K. Dahle, The Influence of 0-0.1 wt.% Ni on the Microstructure and Fluidity Length of Sn-0.7Cu-xNi Journal of Electronic Materials. ,vol. 37, pp. 32- 39 ,(2008) , 10.1007/S11664-007-0281-7
Tao-Chih Chang, Min-Hsiung Hon, Moo-Chin Wang, Intermetallic compounds formation and interfacial adhesion strength of Sn–9Zn–0.5Ag solder alloy hot-dipped on Cu substrate Journal of Alloys and Compounds. ,vol. 352, pp. 168- 174 ,(2003) , 10.1016/S0925-8388(02)01122-2
K. Nogita, C. M. Gourlay, J. Read, T. Nishimura, S. Suenaga, A. K. Dahle, Effects of Phosphorus on Microstructure and Fluidity of Sn-0.7Cu-0.05Ni Lead-Free Solder Materials Transactions. ,vol. 49, pp. 443- 448 ,(2008) , 10.2320/MATERTRANS.MBW200713
B. Drevet, D. Camel, M. Dupuy, J.J. Favier, Microstructure of the Sn—Cu6Sn5 fibrous eutectic and its modification by segregation Acta Materialia. ,vol. 44, pp. 4071- 4084 ,(1996) , 10.1016/S1359-6454(96)00060-2
C.M. Gourlay, J. Read, K. Nogita, A.K. Dahle, The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys Journal of Electronic Materials. ,vol. 37, pp. 51- 60 ,(2008) , 10.1007/S11664-007-0248-8