Interconnects for photovoltaic panels

摘要: Various embodiments of the invention provide an interconnect designed to be placed between layers a photovoltaic laminate, and that has built-in in-plane stress relief features. In accordance with various embodiments, interconnect, once implemented into can withstand at least 200 temperature cycles, as is required by certain certifying bodies, without suffering failure. According one embodiment present invention, provided for connecting first cell bus array or second within comprising: single conductive wire having cross-section sufficient placement laminate; wherein comprises stress-relief feature, feature enables maintain connection while absorbing induced change in position relative cell.