Method for thin film thermoelectric module fabrication
作者： Patrick John Mccann
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摘要: Methods of fabrication a thermoelectric module from thin film material are disclosed. In general, is fabricated by first forming an N-type layer and one or more metallization layers on substrate. The the etched to form number legs. A electrode assembly then bonded portion legs, including legs removed similar manner, second P-type assemblies using flip-chip bonding process complete module.
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