Silicon photonics for switching in next generation data centers

摘要: Inside a data center many thousands of powerful servers need to communicate with high speed and low latency posing challenging requirements the intra-data centers networking. Moreover, scalability, footprint, high-energy efficiency cost are key factors for any new architecture technology that want be candidate use in centers. While optical interconnect has already received large consensus as best inter- intra-rack interconnect, switching is today entirely implemented by electrical packet devices. This paper aims review results European project IRIS (http://www.ict-iris.eu/), i.e. design achieved on CMOS electronic photonic integrated device cost, power, transparent, mass-manufacturable switching. An unprecedented number components (more than 1000), each individually electronically controlled, allows realization transponder aggregator which interconnects up 8 transponders four direction colorless-directionless-contentionless ROADM. Each supports twelve 200 GHz spaced wavelengths, can independently added or dropped from network. ASIC, 3D top chip, controls switch fabrics allow complete us fast reconfigurability.