Integratable assisted cooling system for precision extrusion deposition in the fabrication of 3D scaffolds
作者： Qudus Hamid , Wei Sun
DOI:
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摘要: The present invention relates to an integrated Assisting Cooling (AC) device, system and method for use with PED devices, allowing of biopolymers having higher melting points in the fabrication 3D scaffolds. AC device cools filament as it is extruding from nozzle via low flow convective cooling. allows cooling +/− direction motion on XY plane. elevates material delivery chamber. scaffold at applied temperatures high about 250° C.
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