Molded semiconductor device

摘要: It is an object of the present invention to provide a molded semiconductor device which allows its package be mounted on external circuit even if width conductor high-frequency signal transmission line packaging substrate large, when connected circuit. A chip 3 first metal member 2 by mounting solder AuSn or like bonding. The has terminal second 1 wire 4 Au branched in mold area 6 into two central conductors 1a, 1b extend out 6. ground 2a, 2b are disposed one each side 1b. If existing lead pitch P and M, then distance L between may determined (3×P-M), typically 1.73 mm. Since greater than B (1.3 mm) 10 circuit, can substrate.