Using modeling to determine wafer bias associated with a plasma system
作者： Bradford J. Lyndaker , John C. Valcore
DOI:
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摘要: Systems and methods for determining wafer bias are described. One of the includes detecting output a generator to identify complex voltage current (V&I). The is coupled an impedance matching circuit electrostatic chuck (ESC). method further from V&I projected at point along path between model ESC. operation performed using least part path. applying as input function map value ESC model.
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