作者: Yanfei Liu , Xiaotian Han , Chaoqun Shen , Feng Yao , Mengchen Zhang
DOI: 10.3390/EN12010011
关键词:
摘要: A vapor chamber can meet the cooling requirements of high heat flux electronic equipment. In this paper, based on a proposed with side window, experimental system was designed to visually study its evaporation and condensation transfer performance. Using infrared thermal imaging technology, temperature distribution vapor–liquid two-phase interface evolution inside cavity were experimentally observed. Furthermore, coefficients obtained according measured liquid near evaporator surface condenser surface. The effects load filling rate resistance are analyzed discussed. results indicate that maximized coefficient different from coefficient. showed good performance 33%. According images, it observed evaporation/boiling could be strengthened by interference easily broken bubbles boiling liquid. When input increased, uniformity improved due intensified