In situ polymerization of graphene-polyaniline@polyimide composite films with high EMI shielding and electrical properties
作者： Kui Cheng , Haoliang Li , Mohan Zhu , Hanxun Qiu , Junhe Yang
DOI: 10.1039/C9RA08026K
关键词:
摘要: With the increasing demands of electronics industry, electromagnetic interference (EMI) shielding has become a critical issue that severely restricts application devices. In this work, we have proposed “non-covalent welding” method to fabricate graphene-polyaniline (Gr-PANI) composite fillers. The Gr sheets are welded with PANI via π–π non-covalent interactions. Furthermore, flexible polyimide (PI) film superior EMI effectiveness is prepared by in situ polymerization. 40% content Gr-PANI10:1 (the mass ratio 10 : 1) shows electrical conductivity (σ) as high 2.1 ± 0.1 S cm−1, 1.45 times higher than Gr@PI at same loading. Moreover, total (SET) Gr-PANI10:1@PI reaches ∼21.3 dB and an extremely specific value (SSE) 4096.2 cm2 g−1 achieved. Such approach provides facile strategy prepare high-performance PI-based materials for efficient shielding.
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